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LQFP Series

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LQFP Series

Technology Overview

Low-profile Quad Flat Package (LQFP) refers to a four-sided pin Flat Package with body thickness of 1.0mm or 1.4mm. Mainly suitable for the use of SMT surface mount technology in PCB installation. The distance between the pins of the package is small and the pins are thin. Generally large - scale or very large - scale integrated circuits use this form of package. Pin pitch of 0.4mm-1.0mm and pin number from 32 to 256.

Applications

LQFPs are ideal package for most IC semiconductor technologies such as ASIC, PMU controllers, MCU, gate arrays (FPGA/PLD) and PC chip sets. LQFP packages are particularly well suited for electronic systems requiring broad performance characteristics. Such applications include laptop PCs, video/audio, telecom, RF, data acquisition, set-top box, communication boards and automotive.

Features

¡¡¡ô 7*7mm-28*28 mm package sizes available

¡¡¡ô 32-256 lead counts

¡¡¡ô 0.4, 0.5, 0.65, 0.80 & 1.0 mm lead pitch available

¡¡¡ô Lead frame design capability to meet customer requirements including exposed pad

¡¡¡ô Gold, copper, and Ag alloy wires interconnect, all equipped with mass production facilities

¡¡¡ô High reliability and low cost solution

¡¡¡ô RoHS-6 (green) BOM options for 100% of product family

Key capability£º

¡¡¡ô Automotive products line

¡¡¡ô The assembly process includes 2nd/3rd AOI, plasma, X-ray, IR reflow, TC, SAT, etc;

¡¡¡ô Total wires max:522 wires in MP(0.7mil Au & Cu wire).

¡¡¡ô AEC-Q006/AEC-Q001 /IATF16949 Pass

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¡¡¡ô Ö§³Ö 7*7mm-28*28 mm·â×°³ß´ç

¡¡¡ô 32-256¸öÒý½ÅÊýÁ¿

¡¡¡ô Ö§³Ö 0.4¡¢0.5¡¢0.65¡¢0.80 & 1.0 mmÒý½Å¼ä¾à

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¡¡¡ô רҵµÄ³µ¹æ³ö²úÏß

¡¡¡ô ×é×°Ôì³ÌÔ̺¬3rd AOI, Plasma, X-ray, IR reflow, TC, SATµÈ

¡¡¡ô Á¿²ú×î´óË¿Êý:522¸ù£¨0.7mil Au & Cu wire£©

¡¡¡ô ͨ¹ýAEC-Q006/AEC-Q001 /IATF16949ÈÏÖ¤

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